specifications
PDF(1)
TYPE | DESCRIPTION |
Mfr | Winbond Electronics Corporation |
Series | - |
Package | Tray |
Product Status | ACTIVE |
Package / Case | 200-TFBGA |
Mounting Type | Surface Mount |
Memory Size | 2Gbit |
Memory Type | Volatile |
Operating Temperature | -40°C ~ 105°C (TC) |
Voltage - Supply | 1.06V ~ 1.17V, 1.7V ~ 1.95V |
Technology | SDRAM - Mobile LPDDR4 |
Clock Frequency | 1.6 GHz |
Memory Format | DRAM |
Supplier Device Package | 200-TFBGA (10x14.5) |
Write Cycle Time - Word, Page | 18ns |
Memory Interface | LVSTL_11 |
Access Time | 3.6 ns |
Memory Organization | 128M x 16 |