title
  • image of Microcontrollers, Microprocessor, FPGA Modules>FORLINX-FETMX8MPQ-C+164GOE16(16G)IA10
  • image of Microcontrollers, Microprocessor, FPGA Modules>FORLINX-FETMX8MPQ-C+164GOE16(16G)IA10
  • image of Microcontrollers, Microprocessor, FPGA Modules>FORLINX-FETMX8MPQ-C+164GOE16(16G)IA10
  • image of Microcontrollers, Microprocessor, FPGA Modules>FORLINX-FETMX8MPQ-C+164GOE16(16G)IA10
  • Part number FORLINX-FETMX8MPQ-C+164GOE16(16G)IA10
    Product classification Microcontrollers, Microprocessor, FPGA Modules
    description NXP i.MX8M PlusSOM,4G LPDDR4, 16
    encapsulation Tape & Box (TB)
    quantity 201
    price $131.0000
    RoHS status YES
    specifications
    PDF(1)
    TYPEDESCRIPTION
    MfrForlinx Embedded
    Series-
    PackageTape & Box (TB)
    Product StatusACTIVE
    Connector TypeBoard-to-Board (BTB) 4 x 80 Pin
    Size / Dimension2.441" L x 0.118" W (62.00mm x 32.00mm)
    Speed1.6GHz
    RAM Size4GB
    Operating Temperature-40°C ~ 85°C
    Module/Board TypeMPU
    Core ProcessorARM® Cortex®-A53, ARM® Cortex®-M7
    Flash Size16GB eMMC, 16MB (NOR)