specifications
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| TYPE | DESCRIPTION |
| Mfr | Spansion (Cypress Semiconductor) |
| Series | HOTlink II™ |
| Package | Tray |
| Product Status | OBSOLETE |
| Package / Case | 256-BGA Exposed Pad |
| Mounting Type | Surface Mount |
| Function | Driver |
| Interface | LVTTL |
| Operating Temperature | 0°C ~ 70°C |
| Voltage - Supply | 3.135V ~ 3.465V |
| Current - Supply | 590mA |
| Supplier Device Package | 256-L2BGA (27x27) |
| Number of Circuits | 4 |